USE – a defect classification and signature detection toolsetSemiconductor manufacturing is complex with hundreds of single steps and potentially long per wafer process times. Although the semiconductor manufacturing process has evolved to become a very sophisticated process, mis-processing risks are still high and multiple failure scenarios can occur. Managing and reducing those risks is a major driver for innovations.
To further reduce the cost of scrap and yield loss, manufacturing engineers continue moving away from physical human inspection and toward the introduction of tools which automate defect classification and signature detection within the production environment.
At SEMICON WEST, our experts will present Universal Signature Engine (USE) – a defect classification and signature detection toolset and demonstrate the advantages of reliable and automated classification, supported by a user interface for fast set-up of new classifications and optimization of existing scripts.
SYSTEMA’s Universal Signature Engine (USE) supports risk management in production with a powerful toolset that automatically classifies defects. USE is shipped with a set of algorithms for scratch, ring, spot and cloud detection. Additional customization is possible for prototyping and/or adding new algorithms, further enabling manufacturing engineers to identify tool failures and take immediate action. Manufacturers benefit by avoiding expensive maintenance cycles, achieving improved yield, increasing customer satisfaction, and preventing cost-intensive processing which is scrapped at later stages.
USE advantages at a glance
- Signature Detection
- Cost efficiency
- State of the Art User Interface
- Modul Based System
- Visual Scripting
- Easy to use Process
- Increased Quality
- Reduced Yield Loss